- a thin, flat, crisp cracker or cookie
- anything resembling this, as a thin, flat disk of candy
- a piece of Eucharistic bread, specif., a thin, flat, white, typically round and unleavened piece of such bread, made from wheat
- a small adhesive disk, as of paper, dried paste, gelatin, etc., used as a seal on letters, documents, etc.
- Comput. a thin slice of a semiconductor on which integrated circuits are etched or mounted, as to form a chip
Origin of waferMiddle English wafre from Norman French waufre from Middle Dutch wafel, wafer, waffle
- A small, thin, crisp cake, biscuit, or candy.
- Ecclesiastical A small thin disk of unleavened bread used in the Eucharist.
- Pharmacology A flat, tablet of rice paper or dried flour paste encasing a powdered drug.
- A small disk of adhesive material used as a seal for papers.
- Electronics A small, thin circular slice of a semiconducting material, such as pure silicon, on which an integrated circuit can be formed.
transitive verbwa·fered, wa·fer·ing, wa·fers
- To seal or fasten together with a disk of adhesive material.
- Pharmacology To prepare in the form of wafers.
- Electronics To divide into wafers.
Origin of waferMiddle English wafre from Anglo-Norman variant of Old North French waufre of Germanic origin ; see webh- in Indo-European roots.
- A light, thin, flat biscuit.
- (religion) A thin disk of consecrated unleavened bread used in communion.
- A soft disk originally made of flour, and later of gelatin or a similar substance, used to seal letters, attach papers etc.
- (electronics) A thin disk of silicon or other semiconductor on which an electronic circuit is produced.
(third-person singular simple present wafers, present participle wafering, simple past and past participle wafered)
wafer - Computer Definition
(1) A small, thin continuous-loop magnetic tape cartridge that has been used from time to time for data storage and specialized applications.
(2) The base unit of chip making. A wafer is a slice taken from a salami-like silicon crystal ingot up to 300mm (11.8") in diameter. The larger the wafer, the more chips produced in a single production pass, which comprises a series of photomasking, etching and implantation steps. Wafers are approximately 1/30th of an inch thick; however, the actual layers of transistors that make up the active circuitry are only a few microns deep. Wafers started out being very small from one to three inches in diameter. Then came 100mm ingots (3.9"), followed by 125, 150, 200 and 300mm (450mm is expected in the future). Various wafer sizes are used today depending on the type of chip being made. See chip and wafer scale integration.