A complete system packaged in one housing. A system in package (SiP) contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate. A SiP is really a multichip module (MCM) that contains all the parts of a complete system. The SiP term was first used by Amkor Technology in the late 1990s and not trademarked in order to encourage its use worldwide. See SoC and MCM.