(1) By means of, by way of. From Latin for "way" or "path."

(2) (Virtual Interface Architecture) See VI.

(3) In a printed circuit board, a conducting pathway between two or more substrates (layers). The via is created by drilling through the board at the appropriate place where two or more layers will interconnect and allowing copper to run through the hole. The copper may coat only the sides of the hole or fill the entire hole. See printed circuit board.

(4) In a chip, a conducting pathway between two or more layers. In programmable logic chips that use the antifuse technology, vias are "grown" between two layers. See antifuse.